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Hudin
Arctic Silver 5 Thermal Compound
[AS5]
Arctic Silver 5 Thermal Compound


Rp65.000

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Points Credit : 65 points Currently valued at Rp325

Actual item's appearance may vary from the picture shown.

Artic Silver 5 Thermal Compound / Paste

Introducing Arctic Silver 5 With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability.

 

The Arctic Silver 5 arrives more thicker and Arctic Silver claims that the thickness will improve the spread of the compound and effectively fill in the microscopic valleys between die and CPU

 

Application for CPU,Chipset and Graphic card

Made with 99.9% pure micronized silver

High-Density.Over 88% thermally conductive content by weight

Controlled Triple-Phase Viscosity

Not Electrically Conductive

Easy to apply. Just use a clean plastic and spread on

Absolute Stability. Will not separate, run, migrate, or bleed

 

Arctic Silver 5 is optimized for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions.

 Model
 Brand Artic Silver
 Model Artic Silver 5
 Spec
 Spec Thermal Conductance: >350,000W/m2 °C (0.001 inch layer)
Thermal Resistance: <0.0045°C-in2/Watt (0.001 inch layer)
Average Particle Size: <0.49 microns <0.000020 inch
Extended Temperature Limits: Peak: –50°C to >180°C Long-Term: –50°C to 130°C
Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core
 Features
 Features

3.5 gram

For more information, please visit this products webpage.
This product was added to our catalog on Friday 19 October, 2007.
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Artic Silver
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